[1]史帅达,傅雅琴.聚四氟乙烯纤维/聚酰亚胺低介电常数复合膜的制备及其性能分析[J].浙江理工大学学报,2025,53-54(自科二):139-145.
SHI Shuaida,FU Yaqin.Preparation of a PTFE fiber/polyimide composite film with low dielectric constant and analysis of its properties[J].Journal of Zhejiang Sci-Tech University,2025,53-54(自科二):139-145.
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聚四氟乙烯纤维/聚酰亚胺低介电常数复合膜的制备及其性能分析()
SHI Shuaida,FU Yaqin.Preparation of a PTFE fiber/polyimide composite film with low dielectric constant and analysis of its properties[J].Journal of Zhejiang Sci-Tech University,2025,53-54(自科二):139-145.
浙江理工大学学报[ISSN:1673-3851/CN:33-1338/TS]
- 卷:
- 第53-54卷
- 期数:
- 2025年自科第二期
- 页码:
- 139-145
- 栏目:
- 出版日期:
- 2025-03-10
文章信息/Info
- Title:
- Preparation of a PTFE fiber/polyimide composite film with low dielectric constant and analysis of its properties
- 文章编号:
- 1673-3851 (2025) 03-0139-07
- 分类号:
- TB383-2
- 文献标志码:
- A
- 摘要:
- 为了降低聚酰亚胺（PI）的介电常数和介电损耗，以加捻聚四氟乙烯（PTFE）纤维为中间层，PI膜为底层和表面层，制备PI/PTFE纤维/PI复合膜，并对复合膜的结构形貌、介电性能、击穿强度、力学性能和热性能进行系统分析。结果表明：复合膜保留了PTFE纤维的化学结构和高结晶度，并呈现出内含孔隙的PI/PTFE纤维/PI三明治结构；在制备复合膜时利用加捻PTFE纤维的低介电常数和低介电损耗的特性，同时在复合膜中引入空气，可使制备所得复合膜具有较低的介电常数和介电损耗；在电场频率为10 GHz时，复合膜的介电常数达到1.51，介电损耗达到0.001；复合膜的击穿强度为93.8 kV/mm，较PI膜有所降低；复合膜纵向拉伸强度可达118.9 MPa，失重5%的温度高达534 ℃，表现出良好的力学和热学性能。该研究可为研发高频电场下具有低介电性能的PI提供新的方法和实验参考。
参考文献/References:
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［2］Wang L, Yang J, Cheng W H, et al. Progress on polymer composites with low dielectric constant and low dielectric loss for high-frequency signal transmission［J］. Frontiers in Materials, 2021, 8: 434.
［3］贺娟, 陈文求, 陈伟, 等. 低介电常数聚酰亚胺薄膜材料的研究进展［J］. 绝缘材料, 2023, 56(9): 1-6.
［4］Ni H J, Liu J G, Wang Z H, et al. A review on colorless and optically transparent polyimide films: Chemistry, process and engineering applications［J］. Journal of Industrial and Engineering Chemistry, 2015, 28: 16-27.
［5］Li T, Sun Y, Dai H Y, et al. Characterization of intrinsic low-polyimide films studied by positron annihilation［J］. Materials Science and Engineering: B, 2022, 278: 115652.
［6］Li Y H, Sun G H, Zhou Y, et al. Progress in low dielectric polyimide film: A review［J］. Progress in Organic Coatings, 2022, 172: 107103.
［7］Tafreshi O A, Ghaffari-Mosanenzadeh S, Karamikamkar S, et al. Novel, flexible, and transparent thin film polyimide aerogels with enhanced thermal insulation and high service temperature［J］. Journal of Materials Chemistry C, 2022, 10(13): 5088-5108.
［8］Hu J H, Chen C, Yang F, et al. High performance polyimides containing bio-molecule adenine building block from DNA［J］. Polymer, 2018, 146: 407-419.
［9］Liaw D J, Wang K L, Huang Y C, et al. Advanced polyimide materials: Syntheses, physical properties and applications［J］. Progress in Polymer Science, 2012, 37(7): 907-974.
［10］Kourakata Y, Onodera T, Kasai H, et al. Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes［J］. Polymer, 2021, 212: 123115.
备注/Memo
- 备注/Memo:
-
收稿日期： 2024-04-09
网络出版日期：2024-06-12
基金项目： 国家自然科学基金项目（U20A20264）
作者简介： 史帅达（1998—），男，河南安阳人，硕士研究生，主要从事高频工况下低介电聚酰亚胺复合材料方面的研究
通信作者： 傅雅琴，E-mail:fyq01@zstu.edu.cn
