|本期目录/Table of Contents|

[1]侯红伟,汪蔚.填充型导热环氧树脂复合材料研究进展[J].浙江理工大学学报,2023,49-50(自科二):176-183.
 HOU Hongwei,WANG Wei.Research progress of filled thermal conductive epoxy resin composites[J].Journal of Zhejiang Sci-Tech University,2023,49-50(自科二):176-183.
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填充型导热环氧树脂复合材料研究进展()
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浙江理工大学学报[ISSN:1673-3851/CN:33-1338/TS]

卷:
第49-50卷
期数:
2023年自科第二期
页码:
176-183
栏目:
出版日期:
2023-03-31

文章信息/Info

Title:
Research progress of filled thermal conductive epoxy resin composites
文章编号:
1673-3851 (2023) 03-0176-08
作者:
侯红伟汪蔚
1.浙江理工大学材料科学与工程学院,杭州 310018;2.嘉兴学院材料与纺织工程学院,浙江嘉兴 314001
Author(s):
HOU Hongwei WANG Wei
1.School of Materials Science & Engineering, Zhejiang SciTech University, Hangzhou 310018, China;2.College of Materials and Textile Engineering, Jiaxing University, Jiaxing 314001, China
关键词:
环氧树脂导热填料填料处理导热路径
分类号:
TQ323-5
文献标志码:
A
摘要:
环氧树脂(EP)具有优良的综合性能,在电子封装等领域应用广泛,但其自身热导率较低,如何提升环氧树脂的热导率成为了近年来的研究热点。根据制备工艺,目前主要有本征型和填充型两种制备方法。文章综述了填充型导热环氧树脂复合材料研究进展,从填料类别、填料处理方法以及导热机理与路径进行介绍,最后总结了该领域研究的不足,并对其发展趋势进行了展望。

参考文献/References:

1 ]朱晶 . 全球工业芯片产业现状及对我国工业芯片发展的建议[ J . 中国集成电路 , 2021, 30(S1): 15 - 19, 48.

2]郑有炓.第三代半导体迎来新发展机遇[J. 科技导报, 2021, 39(14): 1-2.

3Shahil K M F, Balandin A A. Graphene-multilayer graphene nanocomposites as highly efficient thermal interface materialsJ. Nano Letters, 2012, 12(2): 861-867.

4Chen H Y, Ginzburg V V, Yang J, et al. Thermal conductivity of polymer-based composites: Fundamentals and applicationsJ. Progress in Polymer Science, 2016, 59: 41-85.

5Bai X, Zhang C X, Zeng X L, et al. Recent progress in thermally conductive polymer/boron nitride composites by constructing three-dimensional networksJ. Composites Communications, 2021, 24: 100650.

6]卢林刚, 陈英辉, 赵瑾, . DOPOMPC-APP-MWCNTs协同阻燃环氧树脂的制备[J.复合材料学报, 2015, 32(1): 101-107.

7Jin F L, Li X, Park S J. Synthesis and application of epoxy resins: a reviewJ. Journal of Industrial and Engineering Chemistry, 2015, 29: 1-11.

8Saba N, Jawaid M, Alothman O Y, et al. Recent advances in epoxy resin, natural fiber-reinforced epoxy composites and their applicationsJ. Journal of Reinforced Plastics and Composites, 2016, 35(6): 447-470.

9Huang X Y, Jiang P K, Tanaka T. A review of dielectric polymer composites with high thermal conductivityJ. IEEE Electrical Insulation Magazine, 2011, 27(4): 8-16.

10Islam A M, Lim H, You N H, et al. Enhanced thermal conductivity of liquid crystalline epoxy resin using controlled linear polymerizationJ. ACS Macro Letters, 2018, 7(10): 1180-1185.

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备注/Memo

备注/Memo:
收稿日期: 2022-10-17
网络出版日期:2022-12-05
基金项目: 浙江省基础公益研究计划项目(LGG19E030006);嘉兴市应用性基础研究专项(2019AD32004)
作者简介: 侯红伟(1997—),男,河南驻马店人,硕士研究生,从事导热环氧树脂方面的研究
通信作者: 汪蔚,Email:zjxuwangwei@163.com
更新日期/Last Update: 2023-04-03